JPH02104644U - - Google Patents
Info
- Publication number
- JPH02104644U JPH02104644U JP1376189U JP1376189U JPH02104644U JP H02104644 U JPH02104644 U JP H02104644U JP 1376189 U JP1376189 U JP 1376189U JP 1376189 U JP1376189 U JP 1376189U JP H02104644 U JPH02104644 U JP H02104644U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- external lead
- lead
- heating
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000005452 bending Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376189U JPH02104644U (en]) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376189U JPH02104644U (en]) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104644U true JPH02104644U (en]) | 1990-08-20 |
Family
ID=31224350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1376189U Pending JPH02104644U (en]) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104644U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05183084A (ja) * | 1991-12-28 | 1993-07-23 | Masahiro Nishio | リード端子のプレス方法及びプレス装置 |
-
1989
- 1989-02-08 JP JP1376189U patent/JPH02104644U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05183084A (ja) * | 1991-12-28 | 1993-07-23 | Masahiro Nishio | リード端子のプレス方法及びプレス装置 |